When it comes to high-frequency applications, every detail matters. Our multilayer PCBs are crafted entirely from high-performance materials, including RO4350B substrates and prepreg adhesives, ensuring superior signal integrity and reliability. For instance, a 4-layer RO4350B PCB is built using 2 cores of RO4350B substrates, offering exceptional electrical performance and thermal stability.

The RO4350B family provides unparalleled flexibility with 8 core thickness options, ranging from 4 mil (0.101 mm) to 60 mil (1.524 mm). This versatility allows for a wide range of stack-up configurations, enabling you to tailor your design to meet specific impedance, thermal, and mechanical requirements.

It's really interesting that a 4 - layer stack - up can be achieved in numerous different ways.

Today, we discussed a 4 - layer RO4350B high - frequency PCB. It is built on 6.6mil and 10mil RO4350B substrates for radar system applications. This RF board has a thickness of 0.82mm, with a minimum track width of 4mil and a gap of 5mil. It is a pure high - frequency multilayer PCB that uses RO4450F as the dielectric prepreg. Other specifications include a white silkscreen on a green solder mask and immersion gold plating on the pads. Each panel contains one board. They are fabricated according to IPC 6012 Class 2 using the provided Gerber data. For shipment, 50 panels are packed together. Here is the detailed stack - up information.

1) Excellent high frequency performance due to low dielectric tolerance and loss;

2) Good high temperature and low temperature resistance（-192℃-260℃);

3) Eligible products rate of first production: >95%

4) Delivery on time: >98%

5) Customer complaint rate: <1%

Modular oscilloscope, Vario-coupler, Tower-mounted booster, Power amplifier Splitter, Acoustic detection sensors, RF Switches, Trunk amplifier

Parameter and data sheet